Low Pressure Molding (LPM) with our Polyamide Hot Melt Adhesives
Used to encapsulate and environmentally protect electronic components against moisture, dust dirt and vibration.
Also used for sealing connectors and molding grommets and strain reliefs. Dimer acid-based polyamide materials, better known as hot-melts, are used as molding compounds.
Our Low-Pressure Mold Polyamides are high-performance thermoplastics that can be processed at low processing pressure due to their low viscosity, allowing encapsulation of fragile components without damage.
Produces no toxic fumes in process and provides a good balance of low and high temperature performance.
Our solutions deliver superior sealing adhesion and excellent temperature and solvent resistance. And the applications vary, such as, automotive sensors, switches, USB sticks, Engine control units, light display boards, micro-inverters, industrial sensors, medical sensors, etc.